The effect of laser irradiation on peel strength of temporary adhesives for wafer bonding
US20160133486A1 - Double Layer Release Temporary Bond and Debond Processes and Systems - Google Patents
Ultrafast lithium disilicate veneer debonding time assisted by a CO2 laser with temperature control
Research of temporary bonding for 3D integrational Microsystem
Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices
Laser De-Bonding, High Tg, Temporary Bonding Adhesive Solutions - AI Technology, Inc.
Optimiertes Debonden ohne Krafteinwirkung
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages | ACS Applied Polymer Materials
EV Group enthüllt wegweisende Laser Debonding Lösung im Niedrigtemperaturbereich für Fan-out Wafer-Level Packaging
IATTJ Paper Template
Temporäres Bonden und De-Bonden
LASER debonding equipment | Shin-Etsu Engineering | Processing & Specialized Services | Business & Products | Shin-Etsu Chemical Co., Ltd.
Laser releasable temporary bonding and debonding processes | Download Scientific Diagram
Temporary Bonding Materials | Bonding and Debonding Technologies
Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing
Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package - ScienceDirect
EV Group enthüllt wegweisende Laser Debonding Lösung im Niedrigtemperaturbereich für Fan-out Wafer-Level Packaging
Advanced wafer bonding and laser debonding | Semantic Scholar
Figure 3 from Advanced wafer bonding and laser debonding | Semantic Scholar
Debondable adhesives and their use in recycling - Green Chemistry (RSC Publishing) DOI:10.1039/D1GC03306A
Process flow for temporary bonding and laser debonding. General a)... | Download Scientific Diagram
Asteroid - Successful Laser Debonding
Bonding and Lithography Equipment Market for More than Moore Devices
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics | Semantic Scholar
Temporary Bonding & Debonding - Semiconductor | 3M US
